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Also Sir Lord Galvanomagnetic I do believe you are taking far to much inspiration from my own ask box and I WILL be suing for copyright infringement
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Your human laws do not apply to me, Skyloftian. My ask box is entirely original anyway. It is you who are in the wrong here.
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Extended and in-depth theory of metallic bonds.
The main problem is that, using X-rays, the types of crystal lattices of different metals were determined, and why they are so and not others is not yet known. For example, copper crystallizes in the fcc lattice, and iron in the bcc lattice, which when heated becomes fcc and this transition is used in heat treatment of steels. Usually in the literature, the metallic bond is described as carried out through the socialization of the outer electrons of the atoms and does not have the property of directionality. Although there are attempts (see below) to explain the directional metal bond since the elements crystallize into a specific type of lattice. The main types of crystal lattices of metals are body-centered cubic; face-centered cubic; hexagonal close-packed. It is still impossible in the general case to deduce the crystal structure of a metal from the electronic structure of the atom from quantum-mechanical calculations, although, for example, Ganzhorn and Delinger pointed out a possible connection between the presence of a cubic body-centered lattice in the subgroups of titanium, vanadium, chromium and the presence of valence d in the atoms of these metals -orbitals. It is easy to see that the four hybrid orbitals are directed along the four solid diagonals of the cube and are well suited for bonding each atom with its 8 neighbors in a body-centered cubic lattice. In this case, the remaining orbitals are directed to the centers of the unit cell faces and, possibly, can take part in the bond of the atom with its six second neighbors. The first coordination number (K.Ch.1) \ "8 \" plus the second coordination number (C.Ch.2) \ "6 \" in total is \ "14 \".
Let us show that the metallic bond in the closest packing (HEC and FCC) between the centrally selected atom and its neighbors, in the general case, is presumably carried out through 9 (nine) directional bonds, in contrast to the number of neighbors equal to 12 (twelve) (coordination number). In the literature, there are many factors affecting crystallization, so I decided to remove them as much as possible, and the metal model in the article, let's say, is ideal, i.e. all atoms are the same (pure metal), crystal lattices without inclusions, without interstices, without defects, etc. Using the Hall effect and other data on properties, as well as calculations by Ashcroft and Mermin, for me the main factor determining the type of lattice turned out to be the outer electrons of the core of an atom or ion, which resulted from the transfer of some of the electrons to the conduction band. It turned out that the metallic bond is due not only to the sharing of electrons, but also to the outer electrons of the atomic cores, which determine the direction or type of the crystal lattice.
Let's try to connect the outer electrons of an atom of a given element with the structure of its crystal lattice, taking into account the need for directed bonds (chemistry) and the presence of socialized electrons (physics) responsible for galvanomagnetic properties. see the main part of the work on p. https://natureofchemicalelements.blogspot.com in Russian and in English
I consider the main achievement of my work that the real first coordination number for atoms in single crystals of pure metals (fcc and HEC crystal lattices) was determined equal to 9. This number was deduced from the physical and chemical properties of crystals.
Sincerely Henadzi Filipenka
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technato · 6 years
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Frequency-Modulated Charge Pumping for Highly Leaky MOS Devices
This webinar will discuss the frequency-modulated charge pumping methodology, in which conventional quasi-dc charge pumping is transformed into a true ac measurement.
Frequency-Modulated Charge Pumping for Highly Leaky MOS Devices
Charge pumping (CP) is one of the most-relied-upon techniques for detecting and quantifying interface defects in metal-oxide-semiconductor devices. As advanced devices have gotten smaller and inherent gate leakage has increased, however, conventional charge pumping has become largely ineffective. This webinar will discuss the frequency-modulated charge pumping methodology, in which conventional quasi-dc charge pumping is transformed into a true ac measurement. The ac detection scheme is not susceptible to gate leakage currents and extends the usefulness of charge pumping as a defect monitoring tool for current and future technologies.
In this webinar, we will cover:
Basic physical understanding and measurement techniques for conventional CP.
Measurement challenges associated with excessive leakage current and the failure of conventional methods.
Physical basis for leakage immunity and experimental methods for implementing simple frequency-modulated CP
Examples using highly leaky technologies and applications relevant to reliability monitoring.
Origin and mitigation strategies (constant shape factor) for hidden frequency-dependent leakage currents.
PRESENTER:
    SPEAKER: Jason P. Campbell, Engineering Physics Division, National Institute of Standards and Technology
Jason P. Campbell received his B.S. and Ph.D. in Engineering Science from the Pennsylvania State University, University Park, PA in 2001 and 2007, respectively. Since 2007, he has been with the National Institute of Standards and Technology (NIST). He has contributed to more than 100 refereed papers and conference proceedings at national and international conferences. His research interests include the negative bias temperature instability, random telegraph noise, galvanomagnetic effects, and magnetic resonance measurements. He served as the general chair of the 2013 International Integrated Reliability Workshop (IIRW).
  SPEAKER: Jason T. Ryan, Engineering Physics Division, National Institute of Standards and Technology
Dr. Ryan is an electrical engineer and leader of the Magnetic Resonance Spectroscopy and Device Metrology Project in the CMOS and Novel Devices Group of the Physical Measurement Laboratory at the National Institute of Standards and Technology (NIST). He received the B.S. degree in Physics from Millersville University, Millersville, PA in 2004. He received the M.S. degree in Engineering Science and the Ph.D. in Materials Science and Engineering from The Pennsylvania State University, University Park, PA in 2006 and 2010, respectively. In 2010, he was awarded a National Research Council post-doctoral fellowship which he spent at NIST where he is currently employed as a staff member and project leader. He has been involved in the technical and managerial committees of both the IEEE International Reliability Physics Symposium and IEEE International Integrated Reliability Workshop conferences. His research interests involve the fundamentals of the atomic scale defects responsible for critical failure and drift mechanisms in advanced microelectronic devices as well as novel experimental methods for electron spin resonance spectroscopy.
Attendance is free. To access the event please register.
NOTE: By registering for this webinar you understand and agree that IEEE Spectrum will share your contact information with the sponsors of this webinar and that both IEEE Spectrum and the sponsors may send email communications to you in the future.​
Frequency-Modulated Charge Pumping for Highly Leaky MOS Devices syndicated from http://ift.tt/2Bq2FuP
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Text
Extended and in-depth theory of metallic bonds.
The main problem is that, using X-rays, the types of crystal lattices of different metals were determined, and why they are so and not others is not yet known. For example, copper crystallizes in the fcc lattice, and iron in the bcc lattice, which when heated becomes fcc and this transition is used in heat treatment of steels. Usually in the literature, the metallic bond is described as carried out through the socialization of the outer electrons of the atoms and does not have the property of directionality. Although there are attempts (see below) to explain the directional metal bond since the elements crystallize into a specific type of lattice. The main types of crystal lattices of metals are body-centered cubic; face-centered cubic; hexagonal close-packed. It is still impossible in the general case to deduce the crystal structure of a metal from the electronic structure of the atom from quantum-mechanical calculations, although, for example, Ganzhorn and Delinger pointed out a possible connection between the presence of a cubic body-centered lattice in the subgroups of titanium, vanadium, chromium and the presence of valence d in the atoms of these metals -orbitals. It is easy to see that the four hybrid orbitals are directed along the four solid diagonals of the cube and are well suited for bonding each atom with its 8 neighbors in a body-centered cubic lattice. In this case, the remaining orbitals are directed to the centers of the unit cell faces and, possibly, can take part in the bond of the atom with its six second neighbors. The first coordination number (K.Ch.1) \ "8 \" plus the second coordination number (C.Ch.2) \ "6 \" in total is \ "14 \".
Let us show that the metallic bond in the closest packing (HEC and FCC) between the centrally selected atom and its neighbors, in the general case, is presumably carried out through 9 (nine) directional bonds, in contrast to the number of neighbors equal to 12 (twelve) (coordination number). In the literature, there are many factors affecting crystallization, so I decided to remove them as much as possible, and the metal model in the article, let's say, is ideal, i.e. all atoms are the same (pure metal), crystal lattices without inclusions, without interstices, without defects, etc. Using the Hall effect and other data on properties, as well as calculations by Ashcroft and Mermin, for me the main factor determining the type of lattice turned out to be the outer electrons of the core of an atom or ion, which resulted from the transfer of some of the electrons to the conduction band. It turned out that the metallic bond is due not only to the sharing of electrons, but also to the outer electrons of the atomic cores, which determine the direction or type of the crystal lattice.
Let's try to connect the outer electrons of an atom of a given element with the structure of its crystal lattice, taking into account the need for directed bonds (chemistry) and the presence of socialized electrons (physics) responsible for galvanomagnetic properties. see the main part of the work on p. https://natureofchemicalelements.blogspot.com in Russian and in English
I consider the main achievement of my work that the real first coordination number for atoms in single crystals of pure metals (fcc and HEC crystal lattices) was determined equal to 9. This number was deduced from the physical and chemical properties of crystals.
Sincerely Henadzi Filipenka
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https://fhenadzi.wordpress.com
Extended and in-depth theory of metallic bonds.
The main problem is that, using X-rays, the types of crystal lattices of different metals were determined, and why they are so and not others is not yet known. For example, copper crystallizes in the fcc lattice, and iron in the bcc lattice, which when heated becomes fcc and this transition is used in heat treatment of steels. Usually in the literature, the metallic bond is described as carried out through the socialization of the outer electrons of the atoms and does not have the property of directionality. Although there are attempts (see below) to explain the directional metal bond since the elements crystallize into a specific type of lattice. The main types of crystal lattices of metals are body-centered cubic; face-centered cubic; hexagonal close-packed. It is still impossible in the general case to deduce the crystal structure of a metal from the electronic structure of the atom from quantum-mechanical calculations, although, for example, Ganzhorn and Delinger pointed out a possible connection between the presence of a cubic body-centered lattice in the subgroups of titanium, vanadium, chromium and the presence of valence d in the atoms of these metals -orbitals. It is easy to see that the four hybrid orbitals are directed along the four solid diagonals of the cube and are well suited for bonding each atom with its 8 neighbors in a body-centered cubic lattice. In this case, the remaining orbitals are directed to the centers of the unit cell faces and, possibly, can take part in the bond of the atom with its six second neighbors. The first coordination number (K.Ch.1) \ "8 \" plus the second coordination number (C.Ch.2) \ "6 \" in total is \ "14 \".
Let us show that the metallic bond in the closest packing (HEC and FCC) between the centrally selected atom and its neighbors, in the general case, is presumably carried out through 9 (nine) directional bonds, in contrast to the number of neighbors equal to 12 (twelve) (coordination number). In the literature, there are many factors affecting crystallization, so I decided to remove them as much as possible, and the metal model in the article, let's say, is ideal, i.e. all atoms are the same (pure metal), crystal lattices without inclusions, without interstices, without defects, etc. Using the Hall effect and other data on properties, as well as calculations by Ashcroft and Mermin, for me the main factor determining the type of lattice turned out to be the outer electrons of the core of an atom or ion, which resulted from the transfer of some of the electrons to the conduction band. It turned out that the metallic bond is due not only to the sharing of electrons, but also to the outer electrons of the atomic cores, which determine the direction or type of the crystal lattice.
Let's try to connect the outer electrons of an atom of a given element with the structure of its crystal lattice, taking into account the need for directed bonds (chemistry) and the presence of socialized electrons (physics) responsible for galvanomagnetic properties. see the main part of the work on p. https://natureofchemicalelements.blogspot.com in Russian and in English
I consider the main achievement of my work that the real first coordination number for atoms in single crystals of pure metals (fcc and HEC crystal lattices) was determined equal to 9. This number was deduced from the physical and chemical properties of crystals.
Sincerely Henadzi Filipenka
0 notes
technato · 6 years
Text
Frequency-Modulated Charge Pumping for Highly Leaky MOS Devices
This webinar will discuss the frequency-modulated charge pumping methodology, in which conventional quasi-dc charge pumping is transformed into a true ac measurement.
Frequency-Modulated Charge Pumping for Highly Leaky MOS Devices
Charge pumping (CP) is one of the most-relied-upon techniques for detecting and quantifying interface defects in metal-oxide-semiconductor devices. As advanced devices have gotten smaller and inherent gate leakage has increased, however, conventional charge pumping has become largely ineffective. This webinar will discuss the frequency-modulated charge pumping methodology, in which conventional quasi-dc charge pumping is transformed into a true ac measurement. The ac detection scheme is not susceptible to gate leakage currents and extends the usefulness of charge pumping as a defect monitoring tool for current and future technologies.
In this webinar, we will cover:
Basic physical understanding and measurement techniques for conventional CP.
Measurement challenges associated with excessive leakage current and the failure of conventional methods.
Physical basis for leakage immunity and experimental methods for implementing simple frequency-modulated CP
Examples using highly leaky technologies and applications relevant to reliability monitoring.
Origin and mitigation strategies (constant shape factor) for hidden frequency-dependent leakage currents.
PRESENTER:
    SPEAKER: Jason P. Campbell, Engineering Physics Division, National Institute of Standards and Technology
Jason P. Campbell received his B.S. and Ph.D. in Engineering Science from the Pennsylvania State University, University Park, PA in 2001 and 2007, respectively. Since 2007, he has been with the National Institute of Standards and Technology (NIST). He has contributed to more than 100 refereed papers and conference proceedings at national and international conferences. His research interests include the negative bias temperature instability, random telegraph noise, galvanomagnetic effects, and magnetic resonance measurements. He served as the general chair of the 2013 International Integrated Reliability Workshop (IIRW).
  SPEAKER: Jason T. Ryan, Engineering Physics Division, National Institute of Standards and Technology
Dr. Ryan is an electrical engineer and leader of the Magnetic Resonance Spectroscopy and Device Metrology Project in the CMOS and Novel Devices Group of the Physical Measurement Laboratory at the National Institute of Standards and Technology (NIST). He received the B.S. degree in Physics from Millersville University, Millersville, PA in 2004. He received the M.S. degree in Engineering Science and the Ph.D. in Materials Science and Engineering from The Pennsylvania State University, University Park, PA in 2006 and 2010, respectively. In 2010, he was awarded a National Research Council post-doctoral fellowship which he spent at NIST where he is currently employed as a staff member and project leader. He has been involved in the technical and managerial committees of both the IEEE International Reliability Physics Symposium and IEEE International Integrated Reliability Workshop conferences. His research interests involve the fundamentals of the atomic scale defects responsible for critical failure and drift mechanisms in advanced microelectronic devices as well as novel experimental methods for electron spin resonance spectroscopy.
Attendance is free. To access the event please register.
NOTE: By registering for this webinar you understand and agree that IEEE Spectrum will share your contact information with the sponsors of this webinar and that both IEEE Spectrum and the sponsors may send email communications to you in the future.​
Frequency-Modulated Charge Pumping for Highly Leaky MOS Devices syndicated from http://ift.tt/2Bq2FuP
0 notes